CARDXX'S POWERFUL ELECTRONICS PACKAGING TECHNOLOGY

CardXX has developed a versatile electronics packaging technology that utilizes patented low-temperature, low-pressure Reaction Injection Molding techniques to securely integrate electronics into small form factors such as smart cards, smart tags, key fobs, memory cards (MultiMedia Cards and Secure Digital Cards) and other portable electronic devices. CardXX’s patented technology can be used with PVC, Polycarbonate, Teslin ™ (i.e. synthetic paper), and a wide range of other materials for specific properties and applications. CardXX partnered with Spyrus, Inc., and utilized our Reaction Assisted Molded Process (RAMP) to manufacture the first smart card to receive Overall Level 3 Certification from the National Institute of Standards and Technology (NIST) for compliance with the FIPS 140 Security Requirements for Cryptographic Modules.