The unique CardXX electronics encapsulation process provides a number of powerful advantages for electronics packaging including

• Injected thermoset polymer completely encapsulates and forms a protective layer around electronic elements to provide superior security and durability
• Low-temperature process enables high volume production with minimized cycle times for very high capacity output
• Low-temperature and low-pressure process prevents damage to delicate electronics and improves manufacturing yield
• Highly flexible molding process enables production of a wide range of varied shapes and form factors
• Superior heat resistance and chemical resistance protects against physical and chemical attacks
• Physical access to chip electronics is difficult to obtain without severe damage or destruction of chip
• Can be applied to Contact, Contactless, and Dual-Interface Smart Cards with no significant tooling changes
• Electronics, including batteries and LED displays may be pre-assembled and tested prior to implantation
• CardXX partnered partnered with Spyrus, Inc., to engineer and manufacture the first smart card to receive Overall Level 3 Certification from the National Institute of Standards and Technology (NIST) for compliance with the FIPS 140 Security Requirements for Cryptographic Modules