Cardxx announces receipt of Notice of Allowance for “Method for Making Memory Cards” from U.S. Patent and Trademark Office

CardXX, a leading smart card manufacturer, today announced that the U.S. Patent Office has issued to Cardxx a patent for a new method for producing Memory Cards. The new patent defines an innovative application of the Reaction Assisted Molded Method (RAMP) method for manufacturing Memory Cards.

The Memory Card patent expands the current patent portfolio of Cardxx, and may indicate favorable prospects for several new technologies of Cardxx that are patent pending, including patents in the areas of Advanced Smart Cards, Sensor Packaging and Battery-powered Smart Cards.

Kevin Kucera, Chief Executive Officer of Cardxx, stated, “We believe this patent positions CardXX as a leader in next-generation smart card manufacturing. The unique capabilities of the low-temperature, low-pressure polymer injection molding technique employed by CardXX are very well suited to the manufacture of next-generation smart cards, and should enable a wide range of new smart card applications. The pending patents will enable the Company to expand into additional industry segments.

CardXX has developed patented technologies to securely encapsulate electronics into Smart Cards and other portable devices or form factors. The CardXX process offers the following unique advantages:

• Injected thermoset polymer encapsulates and protects all electronic elements completely and securely
• Low-temperature and low-pressure process prevents damage to delicate electronics and improves manufacturing yield
• Superior heat resistance and chemical resistance protects against physical and chemical attacks
• Physical access to chip electronics is difficult to obtain without severe damage or destruction of the chip
• Multiple materials can be used for exterior skins including paper for all form factors

Cardxx continues to work with partners developing advanced smart card technologies, including the production of prototype One Time Password smart cards and other multi-factor authentication devices. Cardxx believes its RAMP technology is ideal for integrating advanced electronics, including batteries, speakers, fingerprint sensors, LCD and other displays, integrated circuits on a variety of substrates, and other elements into smart cards, key fobs and other small form factor devices.

About CardXX
CardXX provides secure encapsulation of advanced electronics through manufacturing and licensing secure and intelligent Smart Cards using its proprietary, patented encapsulation process known as the Reaction Assisted Molded Process (RAMP). CardXX has received certification from the National Institute of Standards and Technology (NIST) for overall Level 3 compliance, including physical security with the Federal Information Processing Standard (FIPS) 140 -- Security Requirements for Cryptographic Modules.