Card XX is also a technology company that licenses its patented electronics encapsulation technology to smart card and electronics manufacturers, enabling high-volume production of advanced devices such as RFID cards, tags, fobs, and other intelligent object form factors. CardXX's Reaction Assisted Molded Process (RAMP) is used to securely encapsulate many electronic elements including sensors, memory cards, wireless/contactless electronics, thin film batteries, radiation detectors, location management electronics and other devices.
Licensing CardXX Technology Innovations
CardXX's patented low-temperature and low-pressure injection molding encapsulation technology offers manufacturers a wide range of unique benefits, including:
- Injected thermoset polymer completely encapsulates and forms a protective layer around electronic elements to provide superior security and durability
- Low-temperature process enables high volume production with minimized cycle times for very high capacity output
- Low-temperature and low-pressure process prevents damage to delicate electronics and improves manufacturing yield
- Highly flexible molding process enables production of a wide range of varied shapes and form factors
- Superior heat resistance and chemical resistance protects against physical and chemical attacks
- Physical access to chip electronics is difficult to obtain without severe damage or destruction of chip
- Can be applied to Contact, Contactless, and Dual-Interface Smart Cards with no significant tooling changes
- Electronics, including batteries and LED displays may be pre-assembled and tested prior to implantation
- CardXX partnered with Spyrus, Inc., to engineer and manufacture the first smart card to receive Overall Level 3 Certification from the National Institute of Standards and Technology (NIST) for compliance with the FIPS 140 Security Requirements for Cryptographic Modules
Contact Us to find out about our licensing options |
